D.E.R 6615
Epoxy resin
Dow Chemical
环氧树脂
Epoxy Resins
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Powder coating
Modified Solid Epoxy Resin for Low Temperature Cure Applications
D.E.R.* 6615 solid epoxy resin has
been developed to address the
market need for low melt viscosity
products for low temperature cure
and thin film applications. This product
is based on Dow patented
process technology which allows the
production of resins of low melt viscosity
while still retaining sufficiently
high Mettler softening point. The reactivity
of D.E.R. 6615 resin is excellent
and provides fast curing systems with
excellent flow characteristics and
coating properties.
D.E.R. 6615 resin can be formulated
with the full range of standard phenolic,
amine and polyester crosslinkers.
The resin is also suitable for use in
self-crosslinking systems, i.e.,
homopolymerized through the use of
accelerator only. Applications include:
MDF boards, large metal objects, or
thin film applications.
Powder coatings formulated with
D.E.R. 6615 resin provide:
Low melt viscosity respective to softening point.
Increased reactivity at low cure temperatures.
Formulation versatility.
Modified solid epoxy resin. Used for low temperature cure coatings. Possesses low melt viscosity. Offers very good reactivity, fast cure and very good flow characteristics and coating properties. Can be used in combination with the full range of standard phenolic, amine and polyester crosslinkers.